Soldering compound.



it may v' UNITED sTArEs RAYMOND A. HALL,

SOLDERING sweetness.-

' Be-it known that I, RAYMOND A. HALL, a

citizen of the United States, residing at Dayton the county of Montgomery and State of (lino, have invented, certain new and useful Improvements in SolderihgCompounds;

andI do declare the-following to be a full, clear, and exact description of the invention, such as will enable others'skilled in the art to which itappertains to make and use the same. V

My invention is an improved soldering compound adapted for use in soldering alu- Specification of Letters Patent. Application filed November 22.1906. smarts. 344.629.

PATEN T OFFICE OF DAYTON, 01110.

COMPOUND.

In order to solder aluminium, the same may be cleaned byv scraping where it is to be soldered. The compound is then applied, and pure tin is used as the soldering metal derin -iron in: the usual way. The compoun acts as a. flux. y a

Having thus described my invention, what I claim as new, anddesire to secure 'by Letters Patent, is

consisting of stearicacid, mutton tallow lard and paraflin-wax, substantially in the proportions specified. t

In testimony whereof I have hereunto set my hand in presence of two subscribing witnesses. v

RAYMOND A. HALL. Witnesses:

" E. C. FISCHBACH,

M. S. BENIN.

' :atenteu Karel; 6, 1907. p I

and is-applied by means of an ordinary sol- The herein described soldering compound, I 

